12–14 May 2027 · Osaka, JP

IC & SENSOR PACKAGING EXPO JAPAN - OSAKA

Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging...

Dates
12–14 May 2027
Venue
INTEX OSAKA
Location
Osaka, JP
Frequency
Annual
Audience
Mixed
Duration
3 days
Scale
National
Exhibitors
320Estimate · 40%
Visitors
13,000Estimate · 30%
Area
14,000 m²Estimate · 30%
Electronic Design & ComponentsMeasurement, Control & Testing

Compiled from public sources and periodically reviewed and updated. This information is provided for general guidance only and may be incomplete or out of date — please verify all details directly with the organizer or venue before relying on them.

About IC & SENSOR PACKAGING EXPO JAPAN - OSAKA

IC & SENSOR PACKAGING EXPO JAPAN - OSAKA is a national trade fair for the Electronic Design & Components and Measurement, Control & Testing industries, taking place in Osaka, Japan. The 2027 edition runs 12–14 May 2027 at INTEX OSAKA. It brings together an estimated 320 exhibitors and an estimated 13,000 visitors. Event Scout has indexed 307 exhibiting companies for the event so far.

Venue

INTEX OSAKA

1-5-102 Nanko-Kita, Suminoe Ward, 559-0034 Osaka, Osaka Prefecture, JP

IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2027 exhibitor list

Event Scout has indexed 300+ companies exhibiting at IC & SENSOR PACKAGING EXPO JAPAN - OSAKA so far. They span industries including industrial-automation, software-it,machinery-manufacturing and energy-electronics,machinery-manufacturing. The preview below shows a sample of the indexed roster; the full list is available through Event Scout.

  • Loglass
  • Cloudsign
  • Persol Xtech
  • Sanshin
  • Topse
  • Hrmos
  • Kiei Inc
  • Majisemi
  • Maxell
  • Pulax
  • Studist
  • Mitsubishielectric
  • Videostep
  • CATORCE
  • Musashi Engineering
  • Home
  • Bemac Jp
  • 3s Corp
  • Kyocera
  • Select a Region

+ 282 more exhibitors

Search, filter and export the complete exhibitor list in Event Scout.

Learn more and Subscribefrom €21/month

Related events

Frequently asked questions

When is IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2027?
IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2027 runs 12–14 May 2027 at INTEX OSAKA.
Where is IC & SENSOR PACKAGING EXPO JAPAN - OSAKA held?
IC & SENSOR PACKAGING EXPO JAPAN - OSAKA is held at INTEX OSAKA in Osaka, Japan.
How many exhibitors does IC & SENSOR PACKAGING EXPO JAPAN - OSAKA have?
IC & SENSOR PACKAGING EXPO JAPAN - OSAKA counts an estimated 320 exhibitors. Event Scout has indexed 307 exhibiting companies so far.
Who exhibits at IC & SENSOR PACKAGING EXPO JAPAN - OSAKA?
Indexed exhibitors include Keyence, Hutzper, Panasonic Deutschland and tebiki. The event spans the Electronic Design & Components and Measurement, Control & Testing sectors.

Pragmatic Event Scout

The data on this page comes from Pragmatic Event Scout — a live catalog of 14,000+ trade shows worldwide with the exhibitors at each one, clickable filters, CSV and calendar export, and an AI-assistant connector. Every figure is labeled as a fact or an estimate, so you know exactly which numbers to trust before committing budget.

Learn more and Subscribe →

Logos provided by Logo.dev

See the full exhibitor list

Every exhibitor, every event, searchable — with CSV & calendar export.

Learn more and Subscribe

from €21/month