17–19 Feb 2027 · Tokyo, JP
IC & SENSOR PACKAGING EXPO JAPAN - TOKYO
Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging...
- Dates
- 17–19 Feb 2027
- Venue
- Tokyo Big Sight
- Location
- Tokyo, JP
- Frequency
- Annual
- Audience
- Mixed
- Duration
- 3 days
- Scale
- National
- Exhibitors
- 320Estimate · 40%
- Visitors
- 13,000Estimate · 30%
- Area
- 14,000 m²Estimate · 30%
Compiled from public sources and periodically reviewed and updated. This information is provided for general guidance only and may be incomplete or out of date — please verify all details directly with the organizer or venue before relying on them.
Venue
3 Chome-11-1 Ariake, Koto City, Tokyo 135-0063, 135-0063 Tokyo, Tokyo, JP
Exhibitors discovered (300+)
- K
KeyenceKEYENCE CORPORATION. All Rights Reserve, JP
- H
HutzperJP
- P
Panasonic DeutschlandJP
- t
tebikiJP
- S
Smartf NextaJP
- Loglass
- Cloudsign
- Persol Xtech
- Sanshin
- Topse
- Hrmos
- Kiei Inc
- Majisemi
- Maxell
- Pulax
- Studist
- Bitly
- Mitsubishielectric
- Videostep
- CATORCE
- Musashi Engineering
- Home
- Bemac Jp
- 3s Corp
- Kyocera
+ 283 more exhibitors
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