9–11 Sep 2026 · Chiba, JP

IC & SENSOR PACKAGING EXPO JAPAN - CHIBA

Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging...

Dates
9–11 Sep 2026
Venue
Makuhari Messe
Location
Chiba, JP
Frequency
Annual
Audience
Mixed
Duration
3 days
Scale
National
Exhibitors
320Estimate · 40%
Visitors
13,000Estimate · 30%
Area
14,000 m²Estimate · 30%
Electronic Design & ComponentsMeasurement, Control & Testing

Compiled from public sources and periodically reviewed and updated. This information is provided for general guidance only and may be incomplete or out of date — please verify all details directly with the organizer or venue before relying on them.

Venue

Makuhari Messe

〒261-8550 千葉県, 261-8550 Chiba, Chiba Prefecture, JP

Exhibitors discovered (300+)

  • Loglass
  • Cloudsign
  • Persol Xtech
  • Sanshin
  • Topse
  • Hrmos
  • Kiei Inc
  • Majisemi
  • Maxell
  • Pulax
  • Studist
  • Mitsubishielectric
  • Videostep
  • CATORCE
  • Musashi Engineering
  • Home
  • Bemac Jp
  • 3s Corp
  • Kyocera
  • Select a Region

+ 282 more exhibitors

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