6–8 Oct 2026 · Stuttgart, DE
BONDEXPO
Trade Fair for Industrial Bonding and Joining Technology. Bondexpo focuses on raw materials for adhesives & sealants, machinery, equipment & accessories for the adhesives manufacturing industry
- Dates
- 6–8 Oct 2026
- Location
- Stuttgart, DE
- Frequency
- Annual
- Audience
- Mixed
- Duration
- 3 days
- Scale
- National
- Exhibitors
- 187Estimate · 70%
- Visitors
- 7,000Estimate · 30%
- Area
- 8,000 m²Estimate · 30%
Compiled from public sources and periodically reviewed and updated. This information is provided for general guidance only and may be incomplete or out of date — please verify all details directly with the organizer or venue before relying on them.
Venue
Messepiazza 1, 70629 Stuttgart, Stuttgart, Baden-Württemberg, DE
Exhibitors discovered (180+)
- G
Global Entry PageHenkel AG
- R
Rehm Thermal Systems GmbHBlaubeuren-Seissen Deutschland, DE
- S
Schall Messen
- m
marco systems
- E
EUCHNER
- Formlabs
- HIWIN
- Mink Bürsten
- Plarad
- Bayern Innovativ
- BizLink
- Digital Result • Transparenz schaffen & Prozesse optimieren
- Flexa
- INDO-MIM | Metal Injection Molding Manufacturer
- Innovative Solutions, the Aerospace Industry & Beyond
- Kolektor
- KRAUSE
- Köberlein Technologies
- Luciddoor
- Microjet Minimalmengenschmiersysteme
- Planar Motor
- schmidttechnology.de
- 3D-Drucker, 3D-Scanner und Filament.
- AFT AG
- AIT Goehner GmbH
+ 162 more exhibitors
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