27–29 Oct 2026 · Shenzhen, CN
IC PACKAGING FAIR
IC Packaging Fair. Laminating technology and equipment, Soldering equipment, Test and measurement equipment, Laboratory test and measurement equipment, PCBA section test and measurement equipment, Finished product assembly section test and measurement...
- Dates
- 27–29 Oct 2026
- Location
- Shenzhen, CN
- Frequency
- Annual
- Audience
- Mixed
- Duration
- 3 days
- Scale
- Regional
- Exhibitors
- 220Estimate · 40%
- Visitors
- 9,000Estimate · 30%
- Area
- 10,000 m²Estimate · 30%
Compiled from public sources and periodically reviewed and updated. This information is provided for general guidance only and may be incomplete or out of date — please verify all details directly with the organizer or venue before relying on them.
Venue
2345 Longyang Road, Pudong New Area (浦东新区龙阳路2345号), Shenzhen, Guangdong, CN
Exhibitors discovered (190+)
- 中
中国移动139邮箱
- R
Rehm Thermal Systems GmbHBlaubeuren-Seissen Deutschland, DE
- m
marco systems
- 昂
昂科烧录器_ic烧录机_全自动ic烧录机_自动烧录机
- 海
海目星激光科技集团股份有限公司RMB, CN
- ASMPT Limited
- Hikvision
- PARMI
- Precision Dots
- Professional Soldering Station and Fume Extraction Systems
- SPEA
- Texwipe
- Welcome to Precimeter
- 倚強科技股份有限公司 Aethertek
- 威凯公司官方网站
- 工业ct检测
- 快克智能装备股份有限公司
- 株式会社タムラ製作所
- 浙江京腾智能装备有限公司
- 深圳捷牛科技有限公司
- 유진프리폼 Yujin Preform
- (주)듀오픽스레이
- AOSEN Intelligent Equipment
- AUDIOWELL
- CohPros International Co., Ltd.
+ 168 more exhibitors
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