3–5 Mar 2027 · Sapporo, JP

16th ICCCP-Sapporo

The 16th International Conference on Chemistry and Chemical Process (ICCCP) is an academic meeting focused on chemistry, chemical engineering and chemical processes, bringing together researchers across interdisciplinary tracks such as molecular engineering, industrial process engineering, sustainable chemistry, functional materials, biotechnology and intelligent chemical engineering. It is scheduled to take place in Sapporo, Japan at Hokkaido University from 2027-03-03 to 2027-03-05 and includes paper submission, peer review and publication options in conference proceedings and journals.

Last updated

Dates
3–5 Mar 2027
Venue
Hokkaido University
Location
Sapporo, JP
Frequency
Annual
Audience
Trade
Duration
3 days
Scale
International
Chemicals & Materials
Event website

Compiled from public sources and periodically reviewed and updated. This information is provided for general guidance only and may be incomplete or out of date — please verify all details directly with the organizer or venue before relying on them.

About 16th ICCCP-Sapporo

16th ICCCP-Sapporo is an international trade show in Sapporo, Japan for the Chemicals & Materials industry. The 2027 edition runs 3–5 Mar 2027 at Hokkaido University.

Known editions

Venue

Hokkaido University

060-0808 Sapporo, Hokkaido Prefecture, JP

Exhibitors

We haven't indexed the exhibitors for this event yet. We add them as events are confirmed and rosters are published — please check back soon.

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Frequently asked questions

When is 16th ICCCP-Sapporo 2027?
16th ICCCP-Sapporo 2027 runs 3–5 Mar 2027 at Hokkaido University.
Where is 16th ICCCP-Sapporo held?
16th ICCCP-Sapporo is held at Hokkaido University in Sapporo, Japan.
Is 16th ICCCP-Sapporo worth attending?
16th ICCCP-Sapporo is an international trade show for the Chemicals & Materials industry, so it is most relevant to exhibitors and buyers in that industry. Whether it is worth attending depends on your objectives, but its scale and sector focus are a useful guide.

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