12 May 2027 · Osaka, JP
IC & SENSOR PACKAGING EXPO JAPAN
【2027年5月大阪】ネプコンジャパン
Last updated
- Dates
- 12 May 2027
- Venue
- インテックス大阪
- Location
- Osaka, JP
- Frequency
- Annual
- Audience
- Trade
- Scale
- Regional
- Exhibitors
- 211Estimate
Compiled from public sources and periodically reviewed and updated. This information is provided for general guidance only and may be incomplete or out of date — please verify all details directly with the organizer or venue before relying on them.
About IC & SENSOR PACKAGING EXPO JAPAN
IC & SENSOR PACKAGING EXPO JAPAN is a regional trade fair for the Electronics and Industrial & Manufacturing industries, taking place in Osaka, Japan. The 2027 edition runs 12 May 2027 at インテックス大阪. It brings together an estimated 211 exhibitors. Event Scout has indexed 207 exhibiting companies for the event so far.
Known editions
- 2027Upcoming12 May 2027
Venue
559-0034 Osaka, Osaka Prefecture, JP
Who exhibits at IC & SENSOR PACKAGING EXPO JAPAN
We've captured 207 exhibitors for IC & SENSOR PACKAGING EXPO JAPAN (roster as of 2025). They span 5 countries, 35% of them based outside Japan.
Where exhibitors are based
Exhibitors' head-office countries, most-represented first.
- Japan65%·13
- China10%·2
- Germany10%·2
- Latvia10%·2
- India5%·1
Based on 20 exhibitors with a known head-office country.
What exhibitors do
The industries the exhibitor base works in, by share of the roster.
- Software It46%·5
- Industrial Automation36%·4
- Machinery Manufacturing36%·4
- Services18%·2
- Construction9%·1
Based on 11 exhibitors with an industry label — a company can carry several, so shares can total over 100%.
Exclusivity
Ubiquitous roster — almost all of these exhibitors appear at many other events we track.
Cross-referenced against 207 exhibitors in our event graph.
International reach
Mostly national — largely a home-country field with some international presence.
Compiled from public sources and periodically reviewed and updated. This information is provided for general guidance only and may be incomplete or out of date — please verify all details directly with the organizer or venue before relying on them.
IC & SENSOR PACKAGING EXPO JAPAN 2027 exhibitor list
The IC & SENSOR PACKAGING EXPO JAPAN exhibitor list currently counts 200+ indexed companies. They span industries including software-it, industrial-automation,energy-electronics and packaging,machinery-manufacturing. The preview below shows a sample of the indexed roster; the full list is available through Event Scout.
- N
NECTokyo, JP
- T
THK Global TopRatingen, DE
- T
Toppan東京 台東区, JP
- B
Booster RoboticsCN
- NNTTJP
- SMART CRAFT
- Vrain
- Next →
- Robofull
- UTスリーエム株式会社
- RUN.EDGE株式会社
- Investment and Development Agency of Latvia
- 株式会社Forgers
- EME
- Mimosa Networks
- Tebiki 現場の教育を動画でもっとかんたんに
- TECHMAN ROBOT INC.
- NSK
- HPC
- ArchiTech
- dataPARC
- Zenken株式会社
- AICE
+ 182 more exhibitors
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Frequently asked questions
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