12 May 2027 · Osaka, JP

IC & SENSOR PACKAGING EXPO JAPAN

【2027年5月大阪】ネプコンジャパン

Last updated

Dates
12 May 2027
Venue
インテックス大阪 | INTEX Osaka
Location
Osaka, JP
Audience
Trade
ElectronicsIndustrial & Manufacturing

Compiled from public sources and periodically reviewed and updated. This information is provided for general guidance only and may be incomplete or out of date — please verify all details directly with the organizer or venue before relying on them.

About IC & SENSOR PACKAGING EXPO JAPAN

IC & SENSOR PACKAGING EXPO JAPAN is a trade fair for the Electronics and Industrial & Manufacturing industries, taking place in Osaka, Japan. The 2027 edition runs 12 May 2027 at インテックス大阪 | INTEX Osaka.

Known editions

Venue

インテックス大阪 | INTEX Osaka

インテックス大阪/INTEX Osaka, Osaka, Osaka Prefecture, JP

Exhibitors

We haven't indexed the exhibitors for this event yet. We add them as events are confirmed and rosters are published — please check back soon.

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Frequently asked questions

When is IC & SENSOR PACKAGING EXPO JAPAN 2027?
IC & SENSOR PACKAGING EXPO JAPAN 2027 runs 12 May 2027 at インテックス大阪 | INTEX Osaka.
Where is IC & SENSOR PACKAGING EXPO JAPAN held?
IC & SENSOR PACKAGING EXPO JAPAN is held at インテックス大阪 | INTEX Osaka in Osaka, Japan.
Is IC & SENSOR PACKAGING EXPO JAPAN worth attending?
IC & SENSOR PACKAGING EXPO JAPAN is a trade show for the Electronics and Industrial & Manufacturing industries, so it is most relevant to exhibitors and buyers in those industries. Whether it is worth attending depends on your objectives, but its scale and sector focus are a useful guide.

The data on this page comes from Pragmatic Event Scout — a live catalog of 14,000+ trade shows where every figure is labeled as a fact or an estimate.Logos provided by Logo.dev

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